Topping-out Ceremony of Siemens Shenzhen project

Release time:2026-02-05Hits:41 次

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On February 5, 2026, the main structure topping-out ceremony was held for the High-end Medical Device R&D and Manufacture Center of Siemens Shenzhen Magnetic Resonance Ltd. BMP provided efficient CM services for this project. As an important part of Siemens’ “dual-site operation” model in Shenzhen, this facility is responsible for the research, development, and production of angiography equipment, core magnetic resonance components, as well as Siemens’ newly launched DryCool innovative superconducting magnets. The project covers an area of 63,000 square meters, with a total construction area of 98,000 square meters. The maximum diameter of the piles is 2,200 mm, and the total length of the concrete reperfusion piles amounts to 5.6 km. Through one year of close collaboration between the BMP team, Siemens, the local government, and relevant design and construction partners, a total of 51,000 cubic meters of concrete have been poured so far, and the weight of the installed steel structures amounts to 2,700 tons. For subsequent MEP installation, decorative curtain wall, interior decoration and other work, the BMP team will continue to maintain a high level of efficiency to ensure that the remaining construction tasks are completed on time and with high quality, and ensure that the project to be completed and put into operation promptly, thereby realizing its full potential.